クローバー電子工業株式会社 : プリント配線板の製造販売 : 薄板多層基板B2it基板 ・部品内蔵基板


クローバー電子工業株式会社 > 技術ロードマップ

技術ロードマップ

  • Smaller size, thinner thickness, lighter weight
  • High speed and large-capacity data transmission
  • Higher frequency

Feature Item of development 2016 2017 2018
Small sizeFine Pattern
Line/Space
L/S 30/30
(Subtractive)
L/S 25/25
(Subtractive)
L/S 15/25
(Subtractive)
Small LandLand 90um
(150um pitch)
Land 80um
(120um pitch)
Land 70um
(100um pitch)
Thin thicknessThin board
(6-Layer)
0.220mm
(Prepreg)
0.190mm
(Prepreg)
0.150mm
(Prepreg+Film)
Low CTE(X,Y)
High-Tg(DMA)
CTE 5ppm
Tg 340℃
CTE 3ppm
Tg 340℃
CTE 1~3ppm
Tg 340℃
High speed
transmission
Low dielectric boardDk 4.0
Df 0.005
Dk 3.5
Df 0.0035
Dk 2.4
Df 0.003
FlexibilityFlexibleFlex-LAB
(Polyimide + Prepreg)
Multilayer-Flex
(All Polyimide)
Multilayer-Flex
(All Polyimide)